Recently, Xiamen Tongshida Lighting Co., Ltd. announced that it will develop a new generation of lighting products using Taiwan-based solid-state lighting package-free POD light source devices. After the package is omitted, the overall cost of the LED component will be reduced again. This is the cost theory frequently heard by reporters in the interview. The emergence of these package-free chips has made many packaging companies located in the middle of the LED industry chain feel at risk. Is it a crisis and a battle? Still the best?
What is the package-free package? Is it really unnecessary to package?
Free packaging is not without packaging. National Semiconductor Lighting Engineering R&D and Industry Alliance (CSA) technicians believe that although there has been a period of no-package technology, other domestic companies except Guangzhou Jingke have not yet mass-produced, so the market share is almost zero. The technical personnel introduced, in terms of LED lighting product manufacturing process, it is divided into Level0 to Level5 and other manufacturing processes, in which Level0 is the process of epitaxial and chip, while Level1 encapsulates the LED chip, and Level2 solders the LED on the PCB. Level 3 is the LED module, Level 4 is the illumination source, and Level 5 is the illumination system. The LED factory's unpackaged chip technology mostly omits the development of Level1.
The package-free package is actually a gold-free package, but a gold-line package process is missing. Li Jiansheng, chairman of Shanghai Dinghui Technology Co., Ltd., said that all chip implants are packaged, and each device must be packaged. The package-free chips that appear on the market today are not unpackaged devices, and the two are fundamentally different.
Hundreds of contending for encapsulation have different views on the existence of packaging. Mainly divided into the following three: First, the packaging link will disappear; Second, the packaging link still exists, but not the necessary link; Third, the packaging link will not disappear.
Free packaging is the trend of Professor Shen Chongguang of Peking University Shanghai Institute of Microelectronics. He believes that packaging-free is an inevitable trend of technology development. The manufacturing technology of LED chips is undergoing major changes. The ELC chip without packaging has been in Taiwan for two years ago. R & D and production success, Guangzhou Jingke Electronics is also in production. The high-voltage LEDS developed and produced by the LED chip factory, which is generated on the wafer, has also been released and promoted in some cities.
The package still exists, but it is not necessary to link Chen Haijun, director of the Optoelectronics Research Institute of Ningbo Liaoyuan Lighting Co., Ltd., and he predicts that the upstream epitaxial chip companies will do a good job in the future, and large-scale general-purpose products can be directly selected. However, the characteristics of LEDs determine the variety of products. Therefore, a chip factory cannot meet all the application needs of downstream enterprises. LEDs will not only be used for lighting, so special forms, appearances, types, etc. are required for some special and customized applications. The package will still exist, but it is no longer a necessary link.
The package will not disappear. Ye Likang, deputy general manager of Xiamen Hualian Electronics Co., Ltd., he believes that the development trend will definitely bring a huge impact on LED packaging companies, but as the entire LED industry chain packaging link will not disappear. LED's existing applications are very extensive, and will continue to innovate in the future, and different applications must have the most suitable LED solutions, so all kinds of LED products will coexist, and the packaging products have their own space. In addition, when chip-level package products are mature, chip flip-chip eutectic does not need to be packaged, LED products still need to solve a series of problems such as heat dissipation, optics, weather resistance, reliability, etc., packaging is indispensable.
Since the LED packaging will not disappear, who will do it will bring more value and convenience to the terminal products. Therefore, as an LED packaging company, it must be safe. Ye Likang put forward three suggestions: First, do a good job in positioning and strive to achieve the top in the scale of the sub-sector; Second, through technological innovation, improve the packaging technology level, continue to reduce lumen costs and improve light color quality, keep up with COB / Technologies such as EMC, as well as chip flip-chip eutectic or solder paste reflow soldering process, development of new technologies and new processes such as fluorescent film packaging and remote phosphors. Third, give full play to the advantages of packaging companies to facilitate integration and provide specific applications. The optimized packaging solution, and the downward extension of the package module with drive and control unit, through the joint innovation with the upstream and downstream, to meet the requirements of terminal product dimming, color, solar spectrum, intelligence and so on. As long as the packaging enterprises do better than the upstream and downstream enterprises involved in the packaging process, and have more cost advantages, and can create real value for the end customers, they will be able to form a good pattern of mutual benefit and win-win in the LED industry chain.
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