This technology uses technology disclosed by the Industrial Technology Research Institute (Industrial Research Institute). It is characterized by the use of a grinding process that does not apply excess pressure to the silicon carbide crystals, which reduces processing distortion and improves wafer surface accuracy. The surface roughness is 0.1 nm, which is less than the Ra value (0.3 nm) required for epitaxial film growth. Moreover, it is expected to become a much-anticipated next-generation semiconductor substrate - silicon carbide wafer by shortening the polishing time and improving mass production efficiency. Practical technology. In addition to silicon carbide, it can also be used in the processing of the rapidly expanding white LED substrate material sapphire, gallium nitride (GaN), zinc oxide (ZnO) crystals.
The sample supply has been started in July 2007. In the future, the company plans to improve its small-scale production system and build a mass production system in its own factory (Matsui City, Chiba Prefecture).
Compared with silicon (Si), the mainstream of semiconductor backplane materials, silicon carbide has the advantages of high voltage resistance, high temperature resistance, and low power loss. It is expected to be applied to power equipment, communication systems, and power supply units of power plants such as power generation and transmission. Devices such as electric trains and automobile drives that require high voltage and high current are required. However, since the hardness of silicon carbide is high and it is difficult to perform grinding processing, mass production technology has been a big problem in the past.
PUR (Polyurethane Reactive, Chinese full name is moisture curing reactive polyurethane hot melt Adhesive. The main component is isocyanate-terminated polyurethane prepolymer. The adhesion and toughness of PUR (elasticity can be adjusted, and it has excellent adhesion strength, temperature resistance, chemical resistance and aging resistance) In recent years, it has become the adhesive industry It is one of the important varieties of it. Now it is widely used in packaging, wood processing, automobile, textile, electromechanical, aerospace and other national economic fields.
Reactive hot melt adhesive is under the condition of inhibiting chemical reaction, such as hot melt into fluid, so as to facilitate coating.
After the two adherends are laminated and cooled, the adhesive layer condenses to play a bonding role; then, with the help of the moisture existing in the air and the moisture attached to the surface of the adherend, it reacts with and extends the chain to form a polymer with high cohesion. material, so that the adhesion, heat resistance, low temperature resistance, etc. are significantly improved. Due to its extremely high reactivity, it shows excellent adhesion to a variety of materials, and is widely used in the top cover of washing machines, the top cover of disinfection cabinets, book binding, car lights, furniture edge sealing, shoemaking etc. bonding.
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