Professor Cao Longquan, a professor of materials engineering at Pingtung University of Science and Technology in Taiwan, invented a special solder to make LED thickness less than 0.1cm. LED lamps are as thin as paper and have a high heat dissipation effect. They have won the Gold Medal of International Invention Exhibition.
The current high-power LED lamp module, the use of traditional packaging technology, because the need for metallization, bonding alloy, expensive and the thickness of the thinnest is still greater than 1.5 cm, high thermal resistance.
Cao Longquan through special solder directly to the LED chip bonding, fixed to a special solder made of high-power LED lamp module to reduce packaging steps, levels and thickness, but also has high cooling effect, so that the LED thickness of less than 0.1 cm , Thinner than paper, and pushed costs down 20x.
Cao Longquan's invention of "Thin, High Power LED Lamps" won the gold medal in "2015 (11th) Taipei International Invention and Technology Exhibition". In addition, there are also "multi-functional disassembly crib", "IC chip copper bump surface tin coating and tin plate advanced packaging technology" won the gold medal.
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